Текст страницы
Disassembly and Assembly
3 While pulling up the suction cup with strong, steady force to create the gap between
the back cover and the device frame, place the opening pick in the gap between the
back cover and the device frame and slide the opening pick back and forth along the
edge to slice through the adhesive. Repeat this on all sides and slice through the
adhesive. Lift up the back cover slowly and remove it gently from the device.
• As the back cover can be damaged by excessive force, be careful not to damage the back cover.
• As the internal circuitry can be damaged, do not insert the opening pick more than 3 mm.
• Make sure to leave the opening pick inserted in the edges to prevent the
adhesive from resealing. It is recommended that a larger area of the opening
pick be inserted.
• If you have trouble creating a gap, heat the microwaveable heating bag
additionally, and apply it on the back cover to further soften the adhesive. When
reheating, it should be heated no longer than 30 seconds.