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1.2 Specifications
Platform
• Mini-ITX Form Factor
• 10 Layer PCB
CPU
• Supports Intel® Core™ Ultra Processors (Series 2) (LGA1851)
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
• Supports Intel® Thermal Velocity Boost (TVB)
• Supports Intel® Adaptive Boost Technology (ABT)
• Integrated NPU for dedicated AI acceleration
Chipset
• Intel® B860
Memory
• Dual Channel DDR5 Memory Technology
• 2 x DDR5 DIMM Slots
• Supports DDR5 non-ECC, un-buffered memory up to
9333+(OC)*
• Supports Clocked Unbuffered DIMM (CUDIMM)
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Profile (XMP) 3.0x
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
CPU:
Expansion
Slot
• 1 x PCIe 5.0 x16 Slot (PCIE1), supports x16 mode*
Chipset:
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module and Intel® CNVio/CNVio2 (Integrated WiFi/
BT)
* Supports NVMe SSD as boot disks
Graphics
• Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
• Intel® X
e LPG Graphics Architecture
English
• 1 x HDMI 2.1 TMDS/FRL 8G Compatible, supports HDR,
HDCP 2.3 and max. resolution up to 4K 120Hz
2