Текст страницы
1.2 Specifications
Platform
• Mini-ITX Form Factor
• 8 Layer PCB
• 2oz Copper PCB
CPU
• Supports 14
th, 13
th & 12
th Gen Intel® Core
TM Processors
(LGA1700)
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
• Supports Intel® Thermal Velocity Boost (TVB)
• Supports Intel® Adaptive Boost Technology (ABT)
Chipset
• Intel® B760
Memory
• Dual Channel DDR5 Memory Technology
• 2 x DDR5 DIMM Slots
• Supports DDR5 non-ECC, un-buffered memory up to
8600+(OC)*
1DPC 1R Up to 8600+ MHz (OC), 5600 MHz Natively.
1DPC 2R Up to 7000+ MHz (OC), 5200 MHz Natively.
• Max. capacity of system memory: 96GB
• Supports Intel® Extreme Memory Profile (XMP) 3.0
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
CPU:
Expansion
Slot
• 1 x PCIe 5.0 x16 Slot (PCIE1), supports x16 mode*
Chipset:
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module
* Supports NVMe SSD as boot disks
English
2